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Vacuum Anodic Bonding System





 

We have a case unlike the real thing to a product of a photograph.

  Name : Vacuum Anodic Bonding System
Model : HORIVAC300S
 
icon.gifSummary
   


This equipment consists of process chamber. Vacuum-exhaust system, gas-feed system, heating part and DC high voltage power.
It can be joined silicon wafer and Pyrex Glass substrate with heating, and DC high voltage power, and can be operated vacuum-exhaust, gas-feed system, gas-purge, heating and DC high votage power by manual. 

 
icon.gifSpecification
   
Process substrate  Silicon-Pyrex Glass 
Size  Φ100mm(4inch wafer) 
Heating temperature Max.600℃(using carbon jig)
Pressure range 10 Pa 〜101080 Pa(when blank)
Reach pressure 10 Pa Order 
Power supply 10KVA 200V Φ3 60Hz/50Hz
Gas Inert gas
Cooling water 15litr./min. more
Compressed air 0.5MPa〜0.77MPa
 




                                      
    

株式会社トービ TEL:0471-84-7255 or 080-4075-1975(高橋)
 〒270-1164 千葉県我孫子市つくし野4-6-1-102